Electronic device case and method for treating surface thereof

电子装置壳体及其表面处理方法

Abstract

提供了一种电子装置壳体及其表面处理方法,其中,外壳由铝合金模铸,铝合金层沉积在外壳的外表面上,氧化涂层形成在铝合金层的表面上,密封层形成在氧化涂层的表面的顶上并可以密封氧化涂层中的孔。颜料着色层可以形成在氧化涂层和密封层之间。
An electronic device case and a surface treatment method thereof are provided in which an exterior case is diecast of an aluminum alloy, an aluminum alloy layer is deposited on an outer surface of the exterior case, an oxidized coating layer is formed on a surface of the aluminum alloy layer, and a sealing layer is formed atop the oxidized coating layer and may seal pores therein. A pigment colored layer may be formed between the oxidized coating layer and the sealing layer.

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (3)

    Publication numberPublication dateAssigneeTitle
    CN-101760771-AJune 30, 2010吴江市天龙机械有限公司Anodic oxidation surface treatment process method of aluminum die casting
    KR-20090123615-ADecember 02, 2009박명점, 서정민, 서정호휴대폰 외장재용 다이캐스팅 소재의 표면처리방법 및 그구조
    US-2010183869-A1July 22, 2010Alcoa Inc.Aluminum alloys, aluminum alloy products and methods for making the same

NO-Patent Citations (0)

    Title

Cited By (2)

    Publication numberPublication dateAssigneeTitle
    CN-105163540-ADecember 16, 2015东莞劲胜精密组件股份有限公司, 东莞劲胜通信电子精密组件有限公司一种压铸铝合金的表面处理方法及压铸铝合金、移动终端壳体
    CN-105899099-AAugust 24, 2016惠普发展公司,有限责任合伙企业包括分层金属的设备外壳