Electronic assembly with improved thermal management

具有改善的热控制的电子组件

Abstract

The invention relates to an electronic assembly comprising a leadframe (2), a semiconductor component (3), and an electrically conductive connecting element (4) made of a composite material (5). The connecting element (4) has a solderable metallization (6) on the composite material (5) on a surface that is directed towards the semiconductor component (3). A thermal conductivity of the composite material (5) of the connecting element (4) is greater than a thermal conductivity of the semiconductor component (3) and less than a thermal conductivity of the leadframe (2). The connecting element (4) is provided only locally in the region of the semiconductor component (3).
本发明涉及一种电子组件,包括引线框架(2)、半导体构件(3)、以及由复合材料(5)构成的导电的连接元件(4),其中,连接元件(4)在对准于所述半导体构件(3)的表面上具有在所述复合材料(5)上的能够焊接的金属化部(6),其中,连接元件(4)的复合材料(5)的导热性大于半导体构件(3)的导热性并且小于引线框架(2)的导热性,并且其中,连接元件(4)只局部地设置在半导体构件(3)的区域中。

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Patent Citations (3)

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